Engineer - 6G RF Packaging

Résumé du poste

The engineer will develop advanced 6G RF packaging solutions, including 2.5D/3D integration, embedded shielding, and localized cooling for high-power arrays. They will also perform full-wave EM simulations and coordinate system-level performance evaluations using VNA and thermal measurements.

Détails du poste

Huawei Canada has an immediate permanent opening for an Engineer. About the team: Welcome to the Advanced Wireless Technology Wireless Lab, an epitome of innovation located in Ottawa, Canada. Here, amid the dynamic panorama of technological progress, our team consists mainly of seasoned graduate computer engineers and computer scientists. With diverse experiences ranging from fresh perspectives to decades-long industry immersion, we are united by our fervour for pioneering wireless solutions. About the job: Explore 2.5D/3D integration, wafer-level packaging, diverse interposers, and embedded passives. Study low-loss die-to-die and die-to-package interfaces, including micro-bumps, vias, and waveguide structures. Develop embedded shielding, isolation structures, and localized cooling for high-power RF arrays. Investigate additively manufactured RF structures and engineered materials for prototyping advantages. Perform full-wave EM simulations to quantify interconnect loss, leakage, coupling, and noise. Design package transitions, antenna feeds, and grounding networks across die, substrate, and board boundaries. Coordinate VNA, thermal, and OTA array measurements to evaluate system-level package performance. Partner with internal specialists (RFIC, antenna, materials, manufacturing) to frame cross-disciplinary research. Secure patents and invention disclosures while publishing papers and internal technical reports. The total target annual compensation for this position ranges from $106,000 to $156,000 depending on education, experience, and demonstrated expertise. About the ideal candidate: 5 years of relevant industry experiences. PhD in Electrical Engineering, RF/Microwave Engineering, Packaging, or a related field (or equivalent advanced R&D experience). Deep knowledge of RF/microwave principles. Experience using full-wave EM and circuit simulation tools to model packages and correlate results with measure. Hands-on experience designing test vehicles and directing microelectronics assembly (e.g., PCB, flip-chip, wire bonding, SMT, molding). Proficiency with RF lab equipment (VNAs), probe station. Working knowledge of thermal management, CTE mismatch, stress, warpage, and reliability testing. Additional Information: Huawei Canada is committed to a fair, inclusive, and accessible recruitment process. If you require accommodation during any stage of the hiring process, please let us know and we will work with you to meet your needs. All applications for this position are reviewed directly by our hiring team, we do not use artificial intelligence tools to screen or select candidates.

Ce que vous ferez

The engineer will develop advanced 6G RF packaging solutions, including 2.5D/3D integration, embedded shielding, and localized cooling for high-power arrays. They will also perform full-wave EM simulations and coordinate system-level performance evaluations using VNA and thermal measurements.

Exigences

Candidates must hold a PhD in Electrical Engineering, RF/Microwave Engineering, or a related field with at least 5 years of relevant industry experience. Proficiency in full-wave EM simulation tools, RF lab equipment, and microelectronics assembly processes is required.

Compétences indiquées

• Recruitment · Souhaitée
• Technical · Souhaitée
• Packaging · Souhaitée
• Sens de l’organisation · Souhaitée
• Reliability · Souhaitée
• materials · Souhaitée
• Souci du détail · Souhaitée
• management · Souhaitée
• Process · Souhaitée
• Integration · Souhaitée

Autres compétences pertinentes

Relevées dans la description du poste. Confirmez les exigences importantes ci-dessus.

• 6G RF Packaging
• EM Simulation
• RF/Microwave Engineering
• Wafer-level Packaging
• Antenna Design
• VNA
• Thermal Management
• Microelectronics Assembly
• Flip-chip
• Wire Bonding
• SMT
• Waveguide Structures
• Embedded Shielding
• Reliability Testing
• Circuit Simulation
• Laboratory Equipment
• Research
• Artificial Intelligence
• Antenna
• Electrical Engineering
• Printed Circuit Board
• Electronic Circuit Simulation
• Computer Engineering
• Packaging And Labeling
• Innovation
• Microelectronics
• Molding (Manufacturing Process)
• Electromagnetic Waveguides
• Mechanical Probe Station
• Prototyping
• Radio Frequency
• RF And Microwave Filter
• Simulations
• Waves (Electronics)

Domaines d’emploi

• Engineering
• Technology
• Science & Research
• Manufacturing
• Radio Frequency Engineering Manager
• Radio Frequency (RF) Engineer
• Telecommunications Engineers
• Radio Frequency Identification Device Specialists
• Electronics Engineers, Except Computer