Silicon Photonics Packaging Co-op/Intern

Position Title: Silicon Photonics Packaging Co-op/Intern Number of Position(s): 1 Duration: 4 Months Date: Sept - Dec 2026 Location: Onsite - Ottawa, CA Education Recommendations Currently enrolled in a Master’s or PhD program (Bachelor’s degree holders will not be considered) in Electrical Engineering, Physics, Applied Physics, or a closely related field at an accredited institution in Canada. Advancing connectivity to secure a brighter world. Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world. Learn more about life at Nokia [https://www.nokia.com/careers/life-at-nokia/]. Our recruitment process We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect. If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity. The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia [https://www.nokia.com/careers/#recruitment-process]. Some of our benefits for students in Canada [https://www.nokia.com/careers/our-locations/canada/students-and-graduates/]: * Flexible and hybrid working schemes to balance work and life * Professional development events and networking opportunities * Campus perks designed to make your student experience enjoyable and social, such as access to an onsite cafeteria, free employee parking, complimentary fitness centre, and sports facilities (volleyball, basketball, pickleball courts, ping pong, and employee leagues) * Well-being programs, including Personal Support Service 24/7 – a confidential support channel open to all Nokia employees and their families in challenging situations * Opportunities to join Nokia Employee Resource Groups (NERGs) and connect with people who share your passions and values * Employee Growth Solutions, mentorship programs, and coaching support for your career development * A learning environment that fosters both personal growth and professional development – for your role and beyond Disclaimer for US/Canada Nokia maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role. All North America job posts will post for a minimum of 3 calendar days and up to 180 days or until candidate/s identified.

Design innovative optical transceiver packages and maintain Design Rules documents while conducting simulations and tolerance analyses. Lead package debug activities during product validation and support prototype assembly builds.

Must be currently enrolled in a Master's or PhD program in Electrical Engineering, Physics, or a related field. Requires experience in package design, 2.5D/3D packaging, and documentation of fabrication processes.

• Flexible And Hybrid Working Schemes • Professional Development Events • Networking Opportunities • Onsite Cafeteria • Free Employee Parking • Complimentary Fitness Centre • Sports Facilities • Well-being Programs • Personal Support Service 24/7 • Employee Resource Groups • Mentorship Programs • Coaching Support

Relevées dans la description du poste. Confirmez les exigences importantes ci-dessus.

• Silicon Photonics Packaging
• 2.5D/3D Packaging
• TSVs
• Design For Manufacturing
• Thermo-mechanical Simulations
• ANSYS
• Metrology Techniques
• Optical Packaging
• Semiconductor Back-end Processes
• Free-space Optics
• Fiber Coupling
• Package Debugging
• Tolerance Analysis
• Communication Skills
• Problem-solving Skills

Formation minimale

Autre formation

Expérience minimale

0+ ans