Senior Packaging Technical Engineer - Hardware

Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. Our dynamic work environment demands proactive ownership, as you’ll play a key role in driving technology across multiple functions. In this position, you’ll be responsible for crafting and implementing silicon pad rings, as well as working with a variety of package technology types and complex technologies. This is not just another engineering role—it’s a unique opportunity that actively encourages innovative, out-of-the-box problem solvers to contribute and shape the future of our technology. What you'll be doing: Your responsibilities include defining and implementing the chip pad ring, substrate interconnect scheme, and lead the package layout design process. We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers. Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package! Communicate effectively with various teams throughout the company What we need to see: BSEE or equivalent experience. Minimum of 8+ years in board/system design. Experience with package design is preferred. Good understanding of transmission line theory, power delivery and signal integrity is desired. It is preferred to have programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are useful and a plus. Hardworking and able to work with a minimum of supervision. You seek to solve complex technical problems. Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package. As you plan your future, see what we can offer to you and your family www.nvidiabenefits.com/ Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 168,000 USD - 258,750 USD for Level 4, and 200,000 USD - 322,000 USD for Level 5. You will also be eligible for equity and benefits. Applications for this job will be accepted at least until August 10, 2026. This posting is for an existing vacancy. NVIDIA uses AI tools in its recruiting processes. NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

You will be responsible for defining and implementing chip pad rings, substrate interconnect schemes, and leading the package layout design process. This role involves collaborating with cross-functional teams including circuit, signal integrity, RTL, and system design engineers to ensure robust electrical package performance.

Candidates must hold a BSEE or equivalent degree and possess at least 8 years of experience in board or system design. Proficiency in transmission line theory, power delivery, and scripting languages like Python or Perl is highly desired.

• Competitive salary • Equity • Comprehensive benefits package

• Microsoft ExcelSouhaitée
• PythonSouhaitée

Relevées dans la description du poste. Confirmez les exigences importantes ci-dessus.

• Silicon pad rings
• Package technology
• Package layout design
• Chip floor plan
• Substrate interconnect
• Transmission line theory
• Power delivery
• Signal integrity
• Perl
• Python
• Tcl
• Cadence Skill
• Excel
• Hardware engineering
• Workplace Inclusivity
• Artificial Intelligence
• Cadence SKILL
• Communication
• Perl (Programming Language)
• Packaging And Labeling
• Innovation
• Python (Programming Language)
• Scheme (Programming Language)
• Signal Integrity
• Systems Design
• Tcl (Programming Language)
• Scripting

• Technology
• Engineering
• Software
• Packaging Technician
• Integrated Circuit (IC) Design Engineer
• Electronics Engineers
• Computer Hardware Engineers

Formation minimale

Baccalauréat

Expérience minimale

10+ ans

Langue de l’offre

anglais

Heures de travail

40 heures par semaine