Senior Opto-Mechanical Design Engineer
Offre en anglaisThe role focuses on the physical design, thermal management, and packaging of high-speed optical modules in small form factors like QSFP and OSFP. Responsibilities include managing the full product lifecycle from prototyping and design verification to high-volume manufacturing and supplier engagement.
- Sur place
- Ottawa, ON
- Publié 23 févr. 2026
- Postuler avant le 8 août 2026
- 1 poste
Résumé du poste
Job Description Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle. At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few. Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together. Job Purpose The Senior Opto-Mechanical Design Engineer, as part of the larger product solutions development team, provides mechanical design support of product development, NPI, and manufacturing of a variety of different optical product families. We are looking for an experienced Opto-Mechanical Engineer, with a strong background in mechanical design, and a clear focus on the physical design, thermal management and packaging of high-speed optical modules, in small form factors such as QSFP, OSFP, to support product design and analysis within a worldwide end-to-end product development team developing advanced Opto/microelectronic components, modules and sub-systems. Nature Of Duties / Responsibilities Physical design, thermal management and packaging of high-speed optical modules, in small form factors such as QSFP, OSFP. Experience with CPO design approaches and architectures an asset. Responsibilities include: Mechanical housing subassembly design and module integration, PCB packaging and flex circuit integration, optical fiber routing and interconnects Host system integration considerations of pluggables: insertion/extraction forces, mating cycles, air vs liquid cooling Design for manufacturability, assembly and test to ensure high volume product viability and reliability Design verification through prototyping and device test and characterization Tooling and fixturing requirements definition and design to support prototyping and volume production Supplier engagement to support prototyping and high volume production Work within a multidisciplinary development team to provide a broad range of mechanical design solutions and analysis support to meet design specifications. Product types, include, but are not limited to: Telecommunications and datacom components/modules/subsystems (transceivers, lasers, detectors, modulators, optical receivers, amplifiers, flip chip BGA modules, etc). Sensing / lidar optical components/systems. Medical, biomedical, military etc components. Coordinate activities within the multidisciplinary development team Work with process and test engineering teams to ensure alignment of designs with process and test capabilities Support new business development by interfacing with new customers to understand their requirements and defining proposals and quotations Support new technology research and development as part of AMTs Technology Roadmap Manage key technical elements of projects and their associated timelines in order to meet milestones on various customer projects. Education & Experience Minimum bachelors degree in Engineering 5+ years' experience in a product development role with a focus on transceiver design AutoCAD/SolidWorks design experience with an understanding of FEA using Solidworks / Ansys or similar software tools Experience in the design of RF/Microwave/Optical packages and multi-chip modules Experience in optical and microelectronic technologies, materials, components, assembly and test processes Experience in end-to-end product development, with product manufacturing implementation considered an asset Experience with DFM and FMEA would be an asset Ability to work well within a multidisciplinary development team in a fast-paced environment Strong written and verbal communication skills are required Other Information The compensation range for this position is $100,000-150,000 annually. This position is for an existing vacancy. The hiring process for this position does not use Artificial Intelligence (AI). Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.
Ce que vous ferez
The role focuses on the physical design, thermal management, and packaging of high-speed optical modules in small form factors like QSFP and OSFP. Responsibilities include managing the full product lifecycle from prototyping and design verification to high-volume manufacturing and supplier engagement.
Exigences
Candidates must have a bachelor's degree in Engineering and at least 5 years of experience in product development with a focus on transceiver design. Proficiency in SolidWorks, AutoCAD, and FEA tools is required, along with experience in optical and microelectronic technologies.
Autres compétences pertinentes
Relevées dans la description du poste. Confirmez les exigences importantes ci-dessus.
- Opto-Mechanical Design
- Thermal Management
- Packaging
- AutoCAD
- SolidWorks
- FEA
- Ansys
- DFM
- FMEA
- PCB Packaging
- Optical Fiber Routing
- NPI
- Prototyping
- Module Integration
- RF/Microwave Packaging
- Multi-chip Modules
Domaines d’emploi
- Engineering
- Manufacturing
- Technology
- Science & Research
Renseignements supplémentaires
- Formation minimale
- Baccalauréat
- Expérience minimale
- 5+ ans
- Postuler avant le
- 8 août 2026
- Langue de l’offre
- anglais
- Heures de travail
- 40 heures par semaine
- Niveau d’expérience
- Mid-Senior level