Packaging Engineer - Optical Attach Process

Résumé du poste

The Optical Packaging Engineer will design and optimize high-precision fiber-to-chip alignment processes to bridge photonic integrated circuits with quantum hardware. This role involves hands-on laboratory work, process development, and cross-functional collaboration to scale designs from prototypes to automated assembly lines.

Détails du poste

About Xanadu: Xanadu’s mission is to build quantum computers that are useful and available to people everywhere. At Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been built before. What we are doing is extremely hard, the classic moon shot. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems and literally change the world. And that is something to be excited about! Your role and responsibilities: At Xanadu, an Optical Packaging Engineer plays a critical role on the Hardware Team, bridging photonic integrated circuits (PICs) with scalable, fault-tolerant quantum hardware architectures. The primary mission is developing ultra-low-loss, high-precision fiber-to-chip optical attachment processes to enable rack-scale photonic quantum computers. Hands-on laboratory work: setting up experiments and operating alignment equipment. Perform minimal changes to the machines during process development. Optical Attach & Fiber-to-Chip Alignment: Design, optimize, and characterize high-precision active and passive optical alignment processes to connect fiber arrays, optical connectors, and chiplet structures to photonic integrated circuits with minimal optical loss. Process & Tooling Development: Conduct hands-on optimization of fiber attach tooling and fixtures. Cross-Functional Collaboration: Partner with photonics R&D, mechanical design, electrical packaging, and test engineers to build full optoelectronic assemblies. Scale engineering designs from functional prototype validation to full-scale, automated assembly line production Basic qualifications and experience: Master's degree in Mechanical Engineering, Electrical and Electronic Engineering, Photonics Engineering, Packaging Engineering, Materials Science, or a related technical field. Basic understanding of photonic-based on-chip and off-chip systems. Proven experience with various optical packaging technologies and equipment. Excellent analytical and problem-solving skills. Demonstrated ability to manage complex technical projects from conception to completion. Good communication, presentation, and interpersonal skills, capable of effectively collaborating with diverse teams and stakeholders. Proficiency with CAD software (e.g., SolidWorks, AutoCAD) and statistical analysis tools. Good knowledge of electrical and pneumatics systems. Preferred qualifications and experience: Strong understanding of photonic-based on-chip and off-chip systems. Experience with automation and robotics in packaging. Experience using ficonTEC’s equipment. Familiarity with relevant industry standards and regulations. Minimum of 2+ years of progressive experience in packaging engineering within a manufacturing environment. This is for a new position. Your base salary will be determined based on your location, experience, and internal benchmarks. The base salary range is 110,000 - 140,000 CAD. You will also be eligible for equity and benefits. Our values are important. They are fundamental and lay the foundation for culture at Xanadu. Learn more about our values here. We are an equal opportunity employer and encourage candidates of all backgrounds to apply. We are committed to building an inclusive, safe, and equitable culture and fostering an environment where our employees feel included, valued, and heard. We are committed to meeting the needs of all individuals and support a barrier-free workplace. Should you require accommodations at any point during the recruitment process please contact Recruiting at recruiting@xanadu.ai. Please be advised that we may use artificial intelligence (AI) tools to assist in the screening and assessment of applicants for this position. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.

Ce que vous ferez

The Optical Packaging Engineer will design and optimize high-precision fiber-to-chip alignment processes to bridge photonic integrated circuits with quantum hardware. This role involves hands-on laboratory work, process development, and cross-functional collaboration to scale designs from prototypes to automated assembly lines.

Exigences

Candidates must hold a Master's degree in a relevant engineering or science field and possess at least 2 years of progressive experience in packaging engineering. Proficiency in CAD software, statistical analysis, and a strong understanding of photonic systems are essential for this position.

Avantages

• Equity • Benefits

Compétences indiquées

• SolidWorks · Souhaitée
• AutoCAD · Souhaitée

Autres compétences pertinentes

Relevées dans la description du poste. Confirmez les exigences importantes ci-dessus.

• Optical Packaging
• Photonic Integrated Circuits
• Fiber-to-chip Alignment
• Mechanical Engineering
• Electrical Engineering
• Photonics Engineering
• Packaging Engineering
• Materials Science
• SolidWorks
• AutoCAD
• Statistical Analysis
• Automation
• Robotics
• FiconTEC
• Pneumatics
• Hardware Architecture

Domaines d’emploi

• Engineering
• Technology
• Manufacturing
• Science & Research